19DECEMBER 2020company has started providing failure analysis services for all the semiconductor foundries and designing houses worldwide. Based on its advanced device measurement methodology, highly-professional technique, and adept nano-probe system, MESOSCOPE provides advanced failure analysis for customers to resolve their challenges and overcome the production yield.Touching upon the primary challenges in failure analysis, Huang stresses that most organizations lack the knowledge when placing multiple, similar, sharp probes with good conductivity on shrunken nodes. These obstacles, he underscores, will only aggravate in the future with the increased shrinking of devices. Based on the semiconductor development map, MESOSCOPE is committed to its customers' requirements and empowering them with perfect probes in the most challenging nanoprobing applications. Keeping up with the challenges of today and tomorrow, MESOSCOPE has prepared several models that could be used for failure analysis for the next two generations. "MESOSCOPE is developing tip needle assembling for an advanced generation. The most advanced probe tip of MESOSCOPE is Ultra CR5 plus, and it is for the technology which is smaller than a 2nm semiconductor device. We are ready for the future challenge," he adds. While fabricating nano probes with traditional methods can be extremely challenging, MESOSCOPE has developed its MST(Micro Surface Treatment) module to control apex profile, clean and treat the surface with a high yield rate."MST is a kind of electrical chemical etching technology and has material selective feature for primary removing residue and contamination from surface of probe rapidly. Besides, MST can polish the surface of probe and is available to control dimension and profile of probe in nanometers level," explains Huang, before highlighting that MST is a big leap in overcoming the limitations of traditional methodology to manufacture nano-scale conductive metallic probe tip. With this advantage, MESOSCOPE Technology is capable of controlling profile of probe tip efficiently and accurately. This allows establishing higher form of specification for end-users for failure analysis on their advanced technology device. At the core, MESOSCOPE's MST module enables multiple vital functions such as tip surface cleanness, surface treatment, and probe apex reshaping. MESOSCOPE provides detailed specifications and different magnification SEM images for each tip. When tips are ready for delivery, all the SEM images are uploaded to MESOSCOPE website, whereby the customers can use their customer ID to login to MESOSCOPE Web and see all SEM images of their order. "Besides tips apex, we also provide three parameters to make the tips as similar as possible for customer reference. The tip specifications of MESOSCOPE are very rigorous, making us the preferred choice of our customers," adds Huang. MESOSCOPE brings in a straightforward onboarding process whereby the company follows up regularly for client's usage experience, understands their problems, and updates the development roadmap accordingly. MESOSCOPE also has a strong R&D team that analyses the root cause of the clients' issues and suggests diverse solutions to solve their problems and deliver an enhanced user experience.In the days to come, MESOSCOPE will continue challenging the physics limitations to enhance the applications of nano-probe techniques and establish all failure analysis related scope services. The company is under research and development phase to expand applications of MST. MESOSCOPE also plans to fabricate metallic probe for CAFM, SSRM, SCM, and MFM applications with its probe manufacturing technique. "Compare to traditional silicon substrate with coating conductive material, MESOSCOPE's probe is entirely made of Tungsten to allow much better conductivity. In addition, with over four width-depth ratios at 100nm behind apex, it will bring excellent resolution," concludes Huang. Vincent and shareholders of Mesoscope technologyNeedle on Transistor
< Page 9 | Page 11 >