CXO INSIGHTSCXO INSIGHTS18Scott Green, Principal Solutions Leader, 3D Systems CorporationHarnessing the Power of Additive Manufacturing to Advance Semiconductor Capital Equipment Performance22Aaron Fellis, Vice President, General Manager,Lam ResearchTrends to Watch in the 3D Era20August Miller,Director, R&D Design Center andDaniella Olson,Sr. Design Engineer,Amkor Technology, Inc.Recruitment Challenges in the High-Tech Packaging World24Paul Chen, Head of Global Electronics, TPM and Software Test Mattel, Inc.How To Prepare for the Future of Machine Vision26Eric Young, Senior Analog IC Design Manager, Monolithic Power Systems, Inc.Is Design Reuse a Myth for Analog Circuits?28Matthaeus Artmann, Technology Manager Advanced Technologies, ZKWIlluminating the Path to a Software-Defined Future
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