9MAY 2024The integration of chipsets will enable greater scaling to extend Moore's law.As silicon scaling becomes more expensive, it also becomes more challenging to hold to the traditional development time between technology nodes. Chipmakers are adopting chipset-based solutions to enable scaling beyond silicon. Packaging plays a significant role in driving greater system-in-package integration and extending Moore's Law. TSV etch and plating solutions will be critical in high-aspect-ratio integration schemes for advanced packaging solutions. New substrate-based approaches are also necessary to meet the requirements for next-level interconnect. Lam's recent acquisition of SEMSYSCO broadens its packaging offerings to bring innovative cleaning and plating capabilities for chipset-to-chipset or chipset-to-substrate heterogeneous integration."We are collecting richer data from our equipment and using more advanced data science techniques to convert that into repeatable processing of millions of wafers."Data insights will drive greater operational efficiency.AI-based predictive modeling techniques are accelerating R&D and enabling chipmakers to get to the manufacturing step faster while giving tool and process developers new insights and greater efficiency. Increasingly, data has also become a critical asset during the manufacturing process. In-chamber sensors can monitor tool consistency and help quickly detect issues. A great example is Lam's groundbreaking, self-aware Sense.i® platform, which brings together data intelligence with advanced plasma etch capabilities in a compact, high-density architecture to deliver high-productivity process performance. Powered by Lam's Equipment Intelligence® technology, the Sense.i platform delivers the critical etch capabilities required to continue advancing uniformity and etch profile control to maximize yield and lower wafer costs. Sense.i enables semiconductor manufacturers to capture and analyze data, including pattern recognition, and specify actions for improvement. Sense.i also features autonomous calibration and maintenance capabilities that reduce downtime and labor costs and deliver machine learning algorithms that allow the tool to self-adapt to minimize process variations and maximize wafer output.Sustainable innovation will deliver performant chips that use fewer materials.As demonstrated by Lam's 2021 goal of 100 percent renewable energy by 2030 and to achieve net zero by 2050 and the formation of SEMI's Semiconductor Climate Consortium in 2022, there is increasing focus on advancing sustainability. Many chipmakers are looking for manufacturing equipment and technologies to not only deliver the right performance and cost structure but also support their long-term goals to reduce power consumption and use fewer materials.ConclusionThe growth of sophisticated electronic devices that demand increasingly advanced semiconductor technology challenges WFE providers and chipmakers to think beyond current methods and materials in the 3D era. Continued collaboration, innovation, and new breakthroughs that take fresh approaches and leverage abundant data may hold the keys to powering progress and more sustainable manufacturing to deliver leading-edge technology. Continued collaboration, innovation, and new breakthroughs that take fresh approaches and leverage abundant data may hold the keys to powering progress and more sustainable manufacturing to deliver leading-edge technology
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