4 NOVEMBER 2023IN MY OPINION30Klemens Brunn, President, Heraeus ElectronicsDisplays of the Future: Die- Attach Challenges in Micro LED AssemblyLAST WORD08Rapidly Moving Market of Semiconductor PackagingCherie Sasan, Head of Design and Development, Power Module Technology, Integrated Micro- Electronics, PhilippinesBRINGING UNMATCHED FLEXIBILITY TO IC PACKAGINGC o n t e nt sCOVER STROY12Geoffrey Sylvester, Director of Software Development12
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