6 SEPTEMBER 2022The technological advancements in semiconductor packing techniques are bolstering Asia Pacific's semiconductor testing and assembly industry. Integrated circuit manufacturers are leveraging newer chip-packaging technologies­such as 2.5D ICs and 3D ICs­in their manufacturing procedures, ensuring a higher performance-to-cost ratio. Though these contemporary technologies are at their initial stages, their greater chip connectivity and lower power consumption characteristics are rising their popularity over traditional packaging configurations. This market trend is augmented by the high demands for the Internet of Things (IoT) and wearable smart devices, compelling semiconductor equipment manufacturers to utilize modern testing and packaging technologies. Another driving force behind the growth of APAC's semiconductor testing market is the growing inclusion of semiconductor technologies in automotive designs, with an average new vehicle having computer systems running 100 million software codes. APAC's semiconductor testing market, hence, is set to register a compound annual growth rate of 4.7 per cent, reaching a staggering 42.5 billion USD market size by 2028. This edition of Semiconductor Review APAC brings the spotlight on the key developments in APAC's semiconductor testing segment and highlights how semiconductor manufacturers are leveraging contemporary technologies to adapt to changing consumer demands and market scenarios. The edition features the Top 10 Semiconductor Testing Services Providers in APAC in 2022, such as Inari Amertron Berhad. The company is one of the leading semiconductor testing service providers and renders DC and RF wafer testing, substrate moulding, and other related services.This edition also features thought leadership articles by Adhir Mattu, CIO at Marvell, and Marco Chan, Vice President of Technology at Wise Ally Holdings, sharing their views on how semiconductor companies can leverage higher growth opportunities and how agile development of AI-based defect detection can be utilised in CNN.We hope the valuable insights from industry thought leaders and the cutting-edge service providers from the featured companies in this edition help you make informed decisions. Let us know your thoughts/write to us about how you are leveraging these semiconductor testing services in your organization.Newer Chip-packaging Technologies Driving APAC's Semiconductor Testing DomainJames PhillipsCopyright © 2022 ValleyMedia Inc. All rights reserved. Reproduction in whole or part of any text, photography or illustrations without written permission from the publisher is prohibited. The publisher assumes no responsibility for unsolicited manuscripts, photographs or illustrations. Views and opinions expressed in this publication are not necessarily those of the magazine and accordingly, no liability is assumed by the publisher thereof.Editorial StaffAlex D'souzaRussell ThomasCatalina JosephManaging EditorRichmond Smith*Some of the Insights are based on our interviews with CIOs and CXOsVisualizerChris LynnContact Us:Email:sales@semiconductorreview.comeditor@semiconductorreview.commarketing@semiconductorreview.com September - 05 - 2022, Vol 03 Issue 04Published by ValleyMedia Inc.To subscribe to Semiconductor ReviewVisit www.semiconductorreview.com Richmond smithManaging Editoreditor@semiconductorreview.comYenny TurnerTiffany HayworthAbner LawrenceGina Clumsky
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