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Past Issues

May 2023

Semiconductor Manufacturing

Contents
April-12 2023

Photonics Europe

Contents
February-March 2023

System-on-Chip SoC APAC

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III-December-2022-January 2023

Assembly and Testing Services

Contents
December-05 2022

Semiconductor Tech APAC

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December-02 2022

FPGA APAC

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November-04 2022

Photonics APAC

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October-12 2022

Optoelectronics APAC

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Magazine Archive

Capacitor Special- MAY-1, 2023

Contents

PolyCharge: Lightweight, Thermal-Resistant, and Compact Capacitors

MAY-1

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8

How is your New Product Introduction (NPI)Project Going?

Jeff Kaplan, Corporate Director of Manufacturing Engineering, Spartronics
20

The Evolution of Automotive Seating

Mark Sutton, VP Engineering APAC, Adient [NYSE: ADNT]
22

Innovations in Passive Components for Power Densification

Peter A. Blaise, Senior Director Application Engineering, KEMET, a YAGEO Company
26

Unlocking the true value of Data – Lessons from the journey

Adarsha Marpalli, Global Head, Data Governance and Insights, Nexperia
28

Using Liquid Thermal Interface Materials in Electronics Manufacturing

Jon Urquhart, Director, Global Applications Engineering, PVA
30

How IP brings technological innovation to life

Kristof Beets, Vice President of Technology Insights, Imagination Technologies

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PolyCharge: Lightweight, Thermal-Resistant, and Compact Capacitors

Steven Yializis, COO

PolyCharge: Lightweight, Thermal-Resistant, and Compact Capacitors