Mi Equipment
From Silicon to Circuit Boards

Mi Equipment is a prominent semiconductor solution provider specialising in advanced die sorting and taping, vision inspection, precision die bonding, Known Good Die (KGD) test, and final test solutions. The firm has risen among the ranks to become a preferred global solution provider for semiconductor manufacturing equipment by espousing values such as sustainable innovation and a continually growing passion and creativity.

Mi Equipment has a substantial global presence, with its headquarters in Malaysia and manufacturing facilities in China and Korea. In addition, the company has a broad sales network spanning Asia, North America, and Europe.

“We work closely with our clients to understand their requirements and communicate with them regularly on the roadmap they are considering and the areas they would like us to be more aware of,” states Chee Kheong Teo, VP of Business Development, SEBU

Traditional semiconductor development processes are becoming obsolete in today’s dynamic technological landscape, leading to low yields. As a company committed to innovation, Mi Equipment invests heavily in the latest and most efficient technologies to overcome the technical challenges faced in modern semiconductor manufacturing.

Mi Equipment adopts a targeted approach to achieve higher precision and lower thermal stress in bonding, relying exclusively on the latest laser compression technology rather than established reflow oven methods. Similarly, for inspection purposes, the company employs its proprietary AI technology called MiND.X to overcome the constraints posed by conventional techniques.

Given the intense competition in the global semiconductor race, logistics is an area where companies like Mi Equipment face increasing pressure to deliver high-quality machinery in a timely and cost-effective manner. The company’s commitment to sustainable innovation consistently delivers on this front.

Mi Equipment follows a meticulously organised site-based service approach to support its operations, with each offering assigned to one of its locations. The company’s first facility, established in Malaysia in 2012, focuses on the Mi Series solutions, encompassing die sorting machines for advanced packaging such as WLP, WLCSP, FOWLP, and CSP for flip chips. With the latest model AI enabled Mi Quantum reaching out to market leading UPH, and Mi Quantum Plus for big die size range which also coupled with advanced inspection techniques on laser groove area, Mi Equipment provides greater flexibility with minimal cost of ownership to the customers.

These solutions cater to the telecommunications sector’s requirements for smartphones, tablets, and wearable wireless devices, particularly in the burgeoning 5G market. They are also in demand in the IoT market for compact form factor devices that require high functionality, mobility, and low power consumption. The facility now serves as the company’s headquarters and remains a crucial site in its global network.

In 2020, Mi Equipment continued its expansion by establishing its Taiwan engineering centre, focusing on vision inspection equipment and the Vi Series solutions. These solutions include vision inspection machines for die and package inspection in 2D and 3D modes. Like the Mi series, these solutions cater to the telecommunications sector for smartphones, wearable wireless devices, and the IoT market.

Mi Equipment’s state-of-the-art engineering centre in China, established in 2020, capitalised on the sales and customer support network it had already created in the Chinese market since 2010. The facility primarily offers Si Series Test Solutions for the telecommunications, power and automobile (EV) industries. These solutions include Known Good Die (KGD), Sensors, and fine pitch test handlers at the die and final package levels.

In its most recent market expansion, Mi Equipment established Mi Equipment Korea, focusing on the Ai Series solutions that feature precision bonding solutions for extra-fine pitch thin die and substrate, Low-K devices and warpage sensitive devices. Laser Compression Bonder (LCB) serves as a better bonding solution where it uses laser technology to ensure bonding on thinner die and PCBs, and with better warpage tolerance. With localized heating method and short thermal exposure time, the

LCB provides a higher output and efficiency in the manufacturing process. These solutions are primarily utilised in GPUs and CPUs for high-performance computing in Servers, AI and Blockchain.

Having multiple sites allows Mi Equipment to lower logistics costs for its customers. The company also has several localised service teams in China, Taiwan, and the US. Being close to the service teams enables customers to reduce the overall cost of equipment ownership further while also increasing yield due to frequent maintenance.

Over the years, Mi Equipment has evolved into a global solution provider, continually adapting to changing market demands. The company’s values align with its stakeholders’ requirements, owing to a genuine commitment to the semiconductor sector. Besides its technological advancements, Mi Equipment emphasises hiring procedures to secure skilled engineers, compensate them generously, and provide a friendly workspace.

The company also prioritises customers, fostering long-lasting relationships that give Mi Equipment a significant edge over its technology-centric peers. According to Chee Kheong, Mi Equipment is not only a vision for the future that drives the company, but it is also a quest for its growth.