The European semiconductor industry is advancing packaging technologies to meet demands in various sectors while focusing on innovation research and creating an open ecosystem for chiplet integration.
FREMONT CA: The semiconductor industry in Europe is experiencing rapid growth and innovation, with packaging solutions playing a crucial role in meeting the demands of advanced technologies. In this competitive landscape, European companies are leading the way in developing innovative packaging techniques that address challenges such as thermal management, signal integrity, and sustainability. With advancements in 3D packaging, system-in-package (SiP), and advanced materials, the semiconductor industry in Europe is poised to meet the future needs of diverse sectors, including automotive, telecommunications, and consumer electronics.
Chiplet Architecture: Redefining Semiconductor Design
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The traditional approach to semiconductor design typically involves integrating intellectual property (IP) blocks onto a single chip, known as a System on Chip (SoC). However, this method encounters limitations as die sizes grow beyond reticle capacities, resulting in high development costs. Chiplet architecture presents a new paradigm by allowing the integration of more minor, specialised chips within a single package. This modular approach moves away from the traditional SoC model, opting for a System on Package (SoP) instead.
2.5D and 3D Integration: Increasing Density and Performance
2.5D and 3D advanced packaging techniques enable stacking multiple chips within a single package to achieve higher density and performance. These technologies are fundamental in computing, artificial intelligence, and telecommunications, where integrated systems with high performance are required. 2.5D packaging uses interposers to facilitate interconnections between chiplets, offering high bandwidth and low latency. Meanwhile, 3D integration takes this further by stacking chips vertically to achieve even greater performance density. These packaging technologies are critical in advancing several emerging applications and industries.
Research and Development in Advanced Packaging
The European research community is actively exploring these advanced packaging technologies, focusing on overcoming challenges such as thermal management, interconnect bandwidth, and signal integrity. Key research initiatives aim to support the development of heterogeneous integration technologies, vital for industries like automotive, telecommunications, and healthcare. These efforts include creating pilot lines and design platforms for strengthening the European semiconductor value chain. The aim is to meet the growing demand for high-performance packaging solutions in diverse markets.
Creating a European Open Ecosystem for Chiplet Integration
As semiconductor design evolves, there is a growing need for an open ecosystem for chiplet integration that caters specifically to European markets. This shift is necessary to break free from the industry's closed systems of dominant players. Creating an open and collaborative environment for chiplet integration is essential for Europe. This ecosystem would facilitate greater cooperation across the semiconductor sector, ensuring that Europe can remain competitive in the global market. Efforts are underway to establish standardisation protocols for interconnects between chiplets, fostering a more unified approach to developing semiconductor technologies.
The European industrial ecosystem in semiconductor packaging comprises equipment suppliers catering to global demand and Integrated Device Manufacturers (IDMs) with exclusive capabilities. Most large-volume packaging services are concentrated in Asia, while European providers primarily focus on low-volume, high-value markets, mainly serving sovereign needs. These European companies often face challenges finding suitable suppliers, as local suppliers either lack the necessary capacity or technology, and Asian suppliers cannot handle smaller-volume orders.
The European Chips Act has spurred investments to strengthen research, production capacity, and supply chain resilience, with a dedicated budget for advanced packaging pilot lines. However, there is a noticeable gap between the needs of European small and medium enterprises (SMEs) and the available packaging services within Europe. To address this, the creation of Open pilot facilities has been recommended to support technology transfer and product development processes. The investment required for such facilities depends mainly on the technology being deployed, with more advanced technologies requiring more significant investments. Due to the high costs involved, only some European entities can typically afford the necessary industrial tools alone. Therefore, a mixed business model, where a company with IDM capabilities opens its facilities for services and prototyping, may be required to deploy piloting facilities successfully.
As the industry continues to evolve, European research and development initiatives and efforts to create an open ecosystem for chiplet integration will play a crucial role in maintaining the region’s competitive edge. The establishment of open piloting facilities and strategic investments in advanced packaging capabilities will be essential to support Europe's semiconductor ecosystem's continued growth and resilience.
